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Company PresentationAugust 2016
2Copyright © Infineon Technologies AG 2016. All rights reserved.
Table of contents
About Infineon
Market and business development
Customers, products and technology
General company information
1
2
3
4
2016-08-02
3Copyright © Infineon Technologies AG 2016. All rights reserved.
Infineon at a glance
Financials Market Position*
Business Segments Employees
FY 12 FY 13 FY 14 FY 15527 377 620 897
[EUR m]
Europe14,533 employees
About 35,400 employees worldwide(as of Sep. 2015)
Americas3,682 employees
Asia/Pacific17,209 employees
34 R&D locations19 manufacturing locations
Revenue Segment Result Margin
15.5%14.4%9.8%13.5%
3904 3843 43205795
41%
11%
17%
31%
Automotive (ATV)
Industrial Power Control (IPC)
Chip Card & Security (CCS)
Power Management & Multimarket (PMM)
Revenue FY 2015
# 2 # 1
Automotive Power Smart card ICs
# 2Strategy Analytics,
April 2016IHS Markit,July 2016
IHS Markit,July 2016
2016-08-02
4Copyright © Infineon Technologies AG 2016. All rights reserved.
Part of your life. Part of tomorrow.
We make life easier, safer and greener – with technology that achieves more, consumes
less and is accessible to every one. Microelectronics
from Infineon is the key to a better future.
2016-08-02
5Copyright © Infineon Technologies AG 2016. All rights reserved.
Infineon enables eco-friendly, connected and safe mobility
ApplicationsEfficient powertrain for combustion, electric and hybrid vehicles, charger station for electric vehicles, car safety, driver assistance systems, chassis and comfort electronics, authentication, mobile security, traction
Courtesy: AUDI
2016-08-02
6Copyright © Infineon Technologies AG 2016. All rights reserved.
Infineon enables efficient generation, transmission and conversion of electrical energy
ApplicationsEnergy transmission and conversion, renewable energy generation, home appliances, power tools, power management (adapters, chargers, power supplies), LED lighting systems, mobile devices, industrial drives, industrial vehicles
Courtesy: AUDI
2016-08-02
7Copyright © Infineon Technologies AG 2016. All rights reserved.
Infineon enables security in the connected world
ApplicationsInternet of Things, Industry 4.0, mobile security, embedded security, trusted computing, machine to machine, (mobile) payment, SIM applications, transport ticketing, government identification
Courtesy: AUDI
2016-08-02
8Copyright © Infineon Technologies AG 2016. All rights reserved.
Vishay
STMicro
Fairchild
Mitsubishi
Infineon(incl. IRF)
5.0%
5.7%
6.1%
6.2%
18.6%
Top positions in all major product categories
Discrete power semiconductors and power modulesSource: IHS Markit, July 2016
Microcontroller-based smartcard ICsSource: IHS Markit, July 2016
Automotive semiconductors incl. semiconductor sensorsSource: Strategy Analytics,
April 2016
Automotive semiconductorstotal market in CY 2015:$27.4bn
Powersemiconductorstotal market in CY 2015:$14.8bn
Smart card ICs
total market in CY 2015:$2.72bn
TexasIn-
stru-ments
STMicro
Renesas
Infineon
NXP
7.0%
7.7%
10.3%
10.4%
14.2%
others
STMicro
Samsung
Infineon
NXP
13.3%
15.1%
16.2%
24.8%
30.5%
2016-08-02
9Copyright © Infineon Technologies AG 2016. All rights reserved.
Leadership in system understanding will foster future growth and profitability
#1, system and technology leader
system leader in automotive
Leader insecurity solutions
Competitive advantages Average-cycle financial targets
broadest technology portfolio;#1 in SiGe; become #1 in base stations by 2020
2016-08-02
Auto
Powe
rRF
Secu
rity
Revenue Growth:~8%
Segment Result Margin:~15%
Investment-to-Sales:~13%
10Copyright © Infineon Technologies AG 2016. All rights reserved.
Table of contents
About Infineon
Market and business development
Customers, segments, products and technology
General company information
1
2
3
4
2016-08-02
11Copyright © Infineon Technologies AG 2016. All rights reserved.
The outlook for the global semiconductor market is cautious
Source: WSTS for historical data. Forecast: of WSTS, IHS Markit, Gartner, IC Insights; last update 25 July 2016
Global semiconductor marketin billion $
Forecast revenue rangeMarket size (revenue)
2016-08-02
12Copyright © Infineon Technologies AG 2016. All rights reserved.
Financial Year 2015:Revenue Split by Segment
FY 2015 Revenue: € 5,795m*
* Including International Rectifier from 13 January 2015 to 30 September 2015** Other Operating Segments; Corporate & Eliminations
Chip Card& Security
Automotive
PowerManagement & Multimarket
Industrial Power Control
€ 2,351m
€ 666m
OOS+C&E**
€ 13m
€ 971m
€ 1,794m
41% 17%
31%11%
2016-08-02
13Copyright © Infineon Technologies AG 2016. All rights reserved.
Q3 FY 2016Revenue and Segment Result Growth
[EUR m]
Q3 FY15 Q4 FY15 Q1 FY16 Q2 FY16 Q3 FY16
1,586 1,598 1,556 1,556 1,xxx
245 286 220 228 254
Revenue Segment Result Segment Result Margin
16%18% 14% 14%
+3%
239 1,632
15%
1,611
2016-08-02
14Copyright © Infineon Technologies AG 2016. All rights reserved.
Q3 FY 2016: Revenue, result and margin per segment
* The business with XMC industrial microcontrollers developed by ATV and CCS was transferred to PMM and IPC with effect from 1 October 2015. Previous year’s figures have been adjusted accordingly
ATV* IPC* CCS*PMM*
621 613 614670 676
269 271 249 265 280
517 535 510 496 509
172 181 173 180 172
79 102 81 94 104 30 39 23 26 42 98 110 79 74 79 35 38 35 36 32
Revenue Segment Result Segment Result Margin
+4%
[EUR m]
-2%
15%13% 17% 13% 14%9% 10%14%11% 15%
20% 19%
15%
[EUR m] [EUR m] [EUR m]
0%
20%
16% 16%19% 21%
21% 20%
+9%
2016-08-02
15Copyright © Infineon Technologies AG 2016. All rights reserved.
Infineon GroupResults for FY 2014* and FY 2015**
Segment Result (SR) 620 897
[€ Million] 2014 2015
Net Income 535 634
SR Margin 14.4% 15.5%
Investments 668 785
Free Cash Flow 317 -1.654
Market capitalization*** ~9,240 ~11,355
Net Cash 2,232 220
Revenues Net Income Revenues 4,320 5,795
*** share price as of September 30th, 2014: 8.193 Euro; share price as of September 30th, 2015: 10.055 Euro
FY14 FY15 FY14 FY15
634
4,320
535
5,795+34%
* excl. International Rectifier** Including International Rectifier from 13 January 2015 to 30 September 20152016-08-02
16Copyright © Infineon Technologies AG 2016. All rights reserved.
Infineon GroupResults for Q2 FY16 and Q3 FY16
Segment Result (SR) 228 254
Net Income 180 186
SR Margin 14.2% 15.6%
Gross Cash Position 1,803 2,083
Free Cash Flow 45 277
Net Cash Position 27 299
Revenues 1,611 1,632
186
1,611
180
Q2 FY16 Q3 FY16
1,632+1%
Revenues Net Income
[€ Million] Q2 16 Q3 16
2016-08-02
17Copyright © Infineon Technologies AG 2016. All rights reserved.
Infineon GroupResults for Q3 FY15 and Q3 FY16
Segment Result (SR) 245 254
Net Income 109 186
SR Margin 15.4% 15.6%
Gross Cash Position 1,842 2,083
Free Cash Flow 220 277
Net Cash Position 49 299
Revenues 1,586 1,632+3%
Revenues Net Income
186
1,586
109
Q3 FY15 Q3 FY16
1,632
[€ Million] Q3 15 Q3 16
2016-08-02
18Copyright © Infineon Technologies AG 2016. All rights reserved.
Revenue split by regionsFY 2014* and FY 2015
Americas
11% 12%
Europe, Middle East,Africa (EMEA)
39% 35%
Asia / Pacific
43% 46%
Japan
7% 7%20% 16%therein:
Germany
20% 23%therein: China
FY 2014 FY 2015 *excl. International Rectifier
therein: USA 8% 10%
2016-08-02
19Copyright © Infineon Technologies AG 2016. All rights reserved.
Table of contents
About Infineon
Market and business development
Customers, Products and Technology
General company information
1
2
3
4
2016-08-02
20Copyright © Infineon Technologies AG 2016. All rights reserved.
Tight customer relationships are based on system know-how and app understanding
EMS partners Distribution partners
ATV IPC CCSPMM
2016-08-02
21Copyright © Infineon Technologies AG 2016. All rights reserved.
Market-oriented business structure
Cust
omer
s
ApplicationsSegments
IndustrialPowerControl
CO2 reduction;Comfort electronics;Driver assistance systems;Security
Charger station for electric vehicles; Energy transmission and conversion; Home appliances; Industrial drives; Industrial vehicles; Renewable energy generation; Traction; Uninterruptable power supplies
Authentication; Automotive; Governmental identification documents; Healthcare cards; Internet of Things; Mobile communications; Payment systems incl. mobile payment; Secure NFC (Near Field Communication) transactions; Ticketing, access control; Trusted computing
Cellular network infrastructure; DC motors; HiRel (high-reliability components); LED and conventional lighting systems; Mobile devices; Power management (adapters, chargers, power supplies)
Chip Card & Security
Automotive
Power Management& Multimarket
2016-08-02
22Copyright © Infineon Technologies AG 2016. All rights reserved.
Product range
Industrial Power Control (IPC)› Bare die business› Discrete IGBTs› Driver ICs› IGBT modules (high-
power, medium-power, low-power)
› IGBT module solutions incl. IGBT stacks
Power Management & Multimarket (PMM)› Control ICs› Customized chips (ASICs)› Discrete low-voltage and
high-voltage power transistors
› GPS low-noise amplifier› Industrial microcontrollers› Low-voltage and high-
voltage driver ICs› MEMS and ASICs for
silicon microphones› RF antenna switches› RF power transistors› TVS (transient voltage
suppressor) diode
Chip Card & Security(CCS)› Contact-based security
controllers› Contactless security
controllers› Dual-interface security
controllers (contact-based and contactless)
Automotive(ATV)› 32-bit automotive
microcontrollers for powertrain, safety and driver assistance systems
› Discrete power semiconductors
› IGBT modules› Magnetic and pressure
sensors› Power ICs› Radar› Transceiver (CAN, LIN,
Flex RayTM* )› Voltage regulators
*FlexRay is a trademark licensed by FlexRay Consortium GbR2016-08-02
23Copyright © Infineon Technologies AG 2016. All rights reserved.
Semiconductor technology portfolioTechnology portfolio fits needs of logic and power applications
Digital CMOS: 800nm – 65nmTechnology Nodes (Platform <180nm incl. RF, AMS)Analog/Mixed Signal: 500nm – 180nm Technology Nodes (CxNA) eNVM: EEPROM: IMEMR, C9FL, OTP: C5OP (Automotive)eFlash/EEPROM: 250nm – 65nm CxFL (Chip Card), CxFLA, CxFLN (Automotive)HV-CMOS: 130nm, C11HV/HN
Analog Bipolar: DOPL, Ax, BIPEP, B4CD, HED Analog BiCMOS: B6CA, B6CA-CT, B7CA, SPT170 HV-CMOS-SOI, Levelshift(SOI,JI)Smart Power: 1200-130nm BIP/CMOS/DMOS SPTx (Automotive, EDP) (BCD) Smart: CMOS/DMOS, SMARTx, MSMARTx,
SSMARTx, Opto-TRIAC, SPS
Magnetic: BxCAS, C9FLRN_GMROpto: OP-DI, OP-TR, OP-C9N, µ-modules
C11TOF
DMOS: 12-500V Planar and Trench MOSFET (OptiMOS™, StrongIRFET™)
HV-DMOS: Superjunction MOSFET
(CoolMOS™) IGBT: Planar & Trench 500-6500V,
rev. cond., fast recov. diodesSiC/GaN: Diode, JFET / power switches
Pressure: BxCSP, TIREPx
Silicon-Microphones: DSOUND
adopted for automotive, industrial and for high reliability requirements
Power/Analogincl. Green Robust
MEMS/Sensors
CMOS
RF/Bipolar
RF BiCMOS: 25GHz – 100GHz: B6HFC, B9COPT, B10CBipolar IC: 2GHz...200GHz RF-Bipolar: BxHF SiGe: B7HFM, B7/B9HF_SLC, B7HF200,HiPAC: Al/Cu Integrated Passives B11HFC P7Mxx, P7Dxx, P8Mxx RF Switches: C7NP, C11NP Bipolar/Discretes/MMIC: RF-Transistoren NF-TR; BxHF(D/M) SiGe: B7HFD/M, B7HF_SDLeistungsverst.: LDMOS, LDxM, LDxIC, LD9AB RFMOS: HFMDioden: NF-DI, Tuner: DxT, Schottky: DxS PIN: DxP
2016-08-02
24Copyright © Infineon Technologies AG 2016. All rights reserved.
Package technology portfolio
1) for specialities only 2) phase-out
Through Hole› TO, DIPSMD› TO› DSO› SSOP› SupIR› HBxLeadless› ThinPAK› TDSON› TSDSON› DirectFETTM
› TISON› WISON› IQFN› HSOF› Blade
PowerModules
High Power› Easy› 34mm› 62mm› Econo› Econo-PACK™+› Prime-PACK™› IHM› IHV› Hybrid-PACK™ › MDIP› T-PAK› STACK
Intelligent Power Modules› IRAM› CIPOS™› µIPM™
SMD leaded› SOT› SOD› TSOP› TSSOPFlat lead› TSFP› SC
Leadless› TSLP› TSSLP› TSNP
Wafer level› WLP› WLL
DiscretesPower
Sensors
Through Hole› PSSOSMD Leaded› DSOSP› SSOM› TDSO› TISON
Open cavity› DSOF
Mold on LF› P-MCCxMold› P-Mx.xChip on Flex› P-FTMUV Globe top
› T-Mx.xPRELAM› E-PPxx
Flip Chip› S-MFCx.x› S-COMx.x
Wafer› Bumped› Diced
Chip CardLeadframe
based Packages
Wafer Level Packages, Bare Die
Through Hole› DIP 2)
SMD› PLCC 2)
› TSSOP› TQFP› LQFP › MQFPLeadless› VQFN› WQFN› PQFN› O-LQFN 1)
› XSON› USON
PowerICLaminate
based Packages
SMD › OCCN 1,2)
› BGA› LBGA› LGA› xFBGA, xFSGA
Surface Mount Technology(SMD)
Wafer Levelw/o redistribution› WLP (fan-in)
w/redistribution› WLB (fan-in)› eWLB (fan-out)
Bare Die› Wirebond› Flip chip
2016-08-02
25Copyright © Infineon Technologies AG 2016. All rights reserved.
Table of contents
About Infineon
Market and business development
Customers, segments, products and technology
General company information
1
2
3
4
2016-08-02
26Copyright © Infineon Technologies AG 2016. All rights reserved.
Infineon Functional Chart – global view Effective July 01, 2016This chart does not represent the legally binding structure
Corp
orat
e Fu
ncti
ons Communications
K. WaltherCompliance OfficeM. Reisinger
Distribution, EMS & Mass Market GroupP.-Y. FerrardDesign Enabling & Services H. Hiller
Accounting, Controlling & TaxesR. MarkgrafAudit S. KirschBusiness Continuity W.-R. MoritzBusiness ExcellenceS. Jehmlich
Finance & Treasury A. FoltinHuman ResourcesT. MarquardtInformation TechnologyR. LeindlInvestor RelationsJ. Rebel
Legal & PatentM. v. EickstedtSales & Marketing ExcellenceA. KrappelStrategy, Mergers & AcquisitionsA. Schumacher
Ope
rati
ons Frontend
P. Haidas BackendS. H. Tan
Automotive
P. SchieferA. Müller**M. Seitz*
Industrial Power Control P. WawerJ. Lohse
M. Friedinger*
Chip Card & Security
S. HofschenS. Trautwein*
Power Management & Multimarket
A. UrschitzU. Pelzer*
JapanY. Mori, H. Dairaku
Asia PacificA. Chong, H.-M. Stech
AmericasR. LeFort, A. Prillwitz
Regi
ons
This chart does not represent the legally binding structure R. Ploss (CEO)
D. Asam (CFO) J. Hanebeck H. Gassel (CMO)
*reporting to D. Asam ** reporting to H. Gassel
Boar
d
Operations AmericasJ. McKinney
Corporate Supply ChainK. GruberFinanceP. Gruber*Operations ExcellenceP. Stamminger
PurchasingH.-M. SchweizerQuality ManagementA. Heitzer
2016-08-02
27Copyright © Infineon Technologies AG 2016. All rights reserved.
35,424 Employees Worldwide (as of September 30, 2015)
9,426
174
Mexico
Americas3,682 employees
USA
2,142
297
Asia/Pacific17,209 employees
2,229
9,8471,986
Europe14,533 employees
5323,457
15259
2,1361,546
212 325140
26RomaniaSweden
Germany
Great BritainAustria
PortugalFranceItaly Japan
Singapore
IndiaMalaysiaChina
Korea
Indonesia
163498 Hungary
Taiwan39
19 DenmarkPhilippines
12 Other Europe7 Australia
2016-08-02
28Copyright © Infineon Technologies AG 2016. All rights reserved.
Decisive competitive advantage: Quality
Our standards› International Standards, e.g. TS16949,
ISO 9001, IEC 17025› Specific customer requirements
Our aspiration› Preferred partner for our customers› Smooth production and delivery› We focus on stability and the
100 percent fulfillment of our commitments
Our path› Integrated approach along the entire
value chain› Proactive Quality Management for
products and processes
2016-08-02
29Copyright © Infineon Technologies AG 2016. All rights reserved.
Our global R&D network
Malacca
Ipoh
Beijing
Morgan Hill
Seoul
Shanghai
BangaloreTorrance
WarsteinDuisburg
Bristol
Augsburg
Neubiberg
Padua
Villach
Graz
Regensburg
Dresden
Bukarest
Linz
Warwick
Tewksbury
Irvine
Le Puy Sainte Réparade
Pavia
Skovlunde
El Segundo
San José
Leominster
ChandlerSingapore
Reigate
Manila
Mesa
2016-08-02
30Copyright © Infineon Technologies AG 2016. All rights reserved.
Worldwide manufacturing sites frontend and backend
Dresden Beijing
Wuxi
BatamWarstein Cegléd Malacca
KulimLeominsterSan JoseMorgan Hill
Mesa
Tijuana
Temecula
Singapore
Newport
Cheonan
Regensburg Villach
Frontend Backend
2016-08-02
31Copyright © Infineon Technologies AG 2016. All rights reserved.
Our global sales network
São Paulo
Kokomo
Livonia
Bangalore
Seoul
Singapore
Libanon Beijing
Milpitas
Melbourne,Blackburn
Osaka
Shenzhen
Taipei
Tokyo
Nagoya
Hong Kong
Shanghai
Rotterdam
MilanMarseille
Stuttgart
Paris
Warstein
Madrid
Dublin
Bristol
Stockholm
Espoo
Moscow
Vienna
Erlangen
Zurich
Munich
Hanover
Frankfurt
Xi'an
El Segundo
Reigate
IstanbulBarcelona
Duisburg
Leominster
Hayward
Durham
Raleigh
2016-08-02
32Copyright © Infineon Technologies AG 2016. All rights reserved.
Corporate Social Responsibility (CSR)› CSR comprises our voluntary commitment in: Human Resources
Management and Human Rights, Environmental Sustainability, Occupational Safety and Health, Corporate Citizenship*, CSR Supply Chain Management as well as Business Ethics.
› Infineon entered the UN Global Compact as one of the first semiconductor companies already in 2004 and is voluntary committed to the 10 Principles.
› Infineon is for the 6th time listed in the Sustainability Yearbook. › Infineon is continuously listed in the Dow Jones Sustainability
Index since 2010 and for the first time in the Dow Jones Sustainability World Index in 2015 and thus is among the top 10% of the most sustainable companies in the world.
› Infineon does not compromise in human rights and business ethics.
› Infineon's products and solutions as well as our efficient resources management enable a significant net ecological benefit.
*social engagement of companies. 2016-08-02
33Copyright © Infineon Technologies AG 2016. All rights reserved.
Corporate Social ResponsibilitySuccessful CSR approach
UNGlobal
Compact
since 2004
Infineon IMPRES*)
since 2005
› According to RobecoSAM, Infineon is among the top 10% most sustainable companies worldwide.
› RobecoSAM "Runners-up" Award (2013)
since 2012
Energy Management
System, integrated in
IMPRES*)Dow Jones
Sustainability Index
since 2010
since 2011
Sustainability Yearbook
oekom classification as "Prime"
since 2013STOXX®
Global ESG Leaders Indices
since 2014Dow Jones
Sustainability World Index
since 2015
Continuous Approach
Company FoundationWorldwide certified environmentalmanagement system according toISO 14001
*) Infineon Integrated Management Program for Environment, Energy, Safety and Health
The information and data given in this document apply to the Infineon Technologies group, except for International Rectifier companies.2016-08-02
34Copyright © Infineon Technologies AG 2016. All rights reserved.
Corporate Social Responsibility We are excellent in resources efficiency
About 21% less water consumed per square centimeter produced wafer than the global average
About 40% less electricity consumed per square centimeter produced wafer than the global average
About 50% less waste generated per square centimeter produced wafer than the global average
At Infineon, less is more
We use resources much more efficient in our production processes than the global average of the semiconductor industry.
Basis for the calculations are the square centimeters processed wafer area in the front-end production and consumptions accordingto WSC definition.
The information and data given in this document apply to the Infineon Technologies group, except for International Rectifier companies.
-40% -21% -50%
2016-08-02
35Copyright © Infineon Technologies AG 2016. All rights reserved.
Corporate Social ResponsibilityWe create a net ecologic benefit
The information and data given in this document apply to the Infineon Technologies group, except for International Rectifier companies.
Emission Reduction enabled by our products and solutions
Net ecological benefit:CO2 emissions reduction around 35 million tons
1) This figure considers manufacturing, transportation, function cars, flights, materials, chemicals, water/wastewater, direct emissions, energy consumption, waste, etc. and is based on internally collected data and externally available conversion factors. All data relate to the 2015 fiscal year.2) This figure is based on internally established criteria, which are explained in the explanatory notes. The figure relates to the calendar year 2014 and considers the following fields of application: automotive, LED, PC power supply, renewable energy (wind, photovoltaic), drives as well as induction cookers. CO₂ savings are calculated on the basis of potential savings of technologies in which semiconductors are used. The CO2 savings are allocated on the basis of Infineon market share, semiconductor content and lifetime of technologies concerned, based on internal and external experts' estimations. Despite the fact that CO₂ footprint calculations are subject to imprecision due to the complex issues involved, the results are nevertheless clear.
CO2 savings2)
around36.5
million tonsCO2 equivalents
CO2 burden1)
around1.6
million tonsCO2 equivalents
Ratio around 1:23
2016-08-02
36Copyright © Infineon Technologies AG 2016. All rights reserved.
Business Continuity Integrated management
Business ContinuityISO 27001* ISO 50001***
ISO 14001** OHSAS 18001**
Loss & Fraud Investigations
Real Estate& Facility
Management
Business & Operations
Support
Environmental Affairs,
Sustainability & Energy
Management
InformationSecurity &IT Security
Management
Corporate Social
ResponsibilityExport
ComplianceBusiness
Continuity Planning
Security & Crisis
ManagementAsset
Protection
*ISO 27001: in process of certification; ** ISO 14001/OHSAS 18001 worldwide certification scheme; *** ISO 50001 certified at EU sites2016-08-02
37Copyright © Infineon Technologies AG 2016. All rights reserved.
Let's get connected
www.facebook.com/infineon
www.google.com/+infineon
www.twitter.com/infineon www.youtube.com/infineon
www.infineon.com/xing
www.infineon.com/linkedin
CUSTOMERS PRESS
INVESTORS CAREERS
2016-08-02
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